Description: VEROPAL 14 is a two-component room temperature curing epoxy adhesive. The system has the character of a thixotropic paste and, after curing, exhibits a high degree of strength and high chemical resistance. The system is temperature resistant up to 120 ° C and is capable of filling joints up to 5 mm thick.
Application: For structural bonding of a wide range of substrates, especially composite structures, bonding electronic components.
Substrates: Metals, metal parts, reinforced composite materials (GRP, CFRP), ceramic materials, plastics (ABS, PA, PC ...)
Chemical base: 2-K epoxide
Viscosity before mixing: thixotropic
Viscosity after mixing: thixotropic
Pot life: 60 min
Tg (°C) DSC: 80 - 85°C